I-Connect007 is launching Advanced Electronics Packaging Digest to address the industry’s urgent need for insight into next-gen packaging technologies and the manufacturing processes that support them. As systems grow smaller and more powerful, this newsletter reflects our commitment to keeping readers at the forefront of innovation.
Marketing Highlights
- Trusted by a well-established, loyal readership
- Delivered monthly for consistent audience engagement
- Curated and original content from respected industry authorities
- Backed by the Global Electronics Association, the voice of the global electronics industry and leading authority in advanced packaging
- Content also available on Substack, whose platform reaches 3 million.
Readership Highlights
Each month, Advanced Electronics Packaging Digest reaches PCB designers, board manufacturers, assembly and EMS companies, suppliers, technologists, and OEMs.
Delivered directly to subscribers’ inboxes, the digest features in-depth coverage of the most critical developments in advanced electronics packaging. It offers actionable insights for both engineers and senior executives, helping them stay informed and competitive in a rapidly evolving market.
Our audience includes influential, high-level decision-makers with purchasing authority—recognized experts who are shaping the future of the industry.
Ad Types
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Publish Schedule
- Advanced Electronics Packaging Digest is published monthly. Publish day modified to accommodate holidays for maximum visibility.
